High-Density Interconnection or HDI and Flip-chip are revolutionizing the production of precision electronics. Traditional blind via inspection employed only a 3D measuring machine and a coaxial light. Blind vias were inspected one by one an approach that was labor intensive, painstaking and impractical. Our new LV265 system reduces the inspection time of HDI and Flip-chip panels from hours to mere minutes!

• The most cost-efficient solution for your laser-drilling inspection needs
• Fast scan for blind via defects ensures high laser drilling quality
• Use Target & Distribute plus diagrams to optimize your laser drilling parameters

The LV265 system provides complete inspection capability. Because of our brilliant line-scan technology, the measuring time will depend on the board size not the amount of via. A 50cm by 50cm board can be processed within minutes.

The LV265 system inspects for all of the following blind via defects: board shrinkage/expansion, conformal mask shifts, missing etchings, underdrilling, overdrilling, pad shifts, bias drilling, and relative size differences. Diagrams from our patented Target & Distribute plus analysis tool reveal both the distribution and nature of defects. This analysis can be used to properly adjust your laser drilling parameters for increased efficiency. With a faster inspection time and the tools for complete analysis, the LV265 gives you the competitive edge that you need. To fit in different measuring requirement, we provide 2 models for FR4 and ABF inspection.