3D AOI
3D BUMP |
3D Inlay Coin |
3D雷射鑽孔 |
凹陷剖面圖 |
深度分布圖 |
Because of high density and high reliability trend for advanced PCB and IC substrate, copper-filling plating and stack-via technology become more popular. As the factors to change plating results are many, plating quality is required to be inspected and monitored. 3D AOI utilizes fast 3D measuring technology to scan all the dimples on panels and also provides statistical reports to mirror copper-filling plating results.
>High throughput 3D technology for full panel scan.
>Provides accurate dimple measuring results proven by traceable 3D standard target.
>Plating reliability improved by monitoring copper filling outcome.
>Complete analysis provides various inspection data and diagrams.
>Production mode or engineering mode can be performed by different demands.
>Effective dimple analysis tools are equipped to save considerable engineering time.
>On-line recheck one by one, and offline recheck inspection result improves the inspection efficiency.