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Solid Measuring Viewer

       

BUMP

 

Dimple

 

SMT pad

 

LaserVia

 

Drill Hole

SMV system is designed to perform automatic final inspecting system. SMV integrates professional vision and optics technology. Besides, reliable mechanical system reduces the maintenance time. It is especially suitable for the demand for high quality and low cost inspection. Unique inspection techniques adapt to all 3D measuring. It can detect laser Via, dimple, bump, copper plating thickness, line, SMT, BGA, etc. SMV provides 3D image and 3D measuring result. SMV adopts programmable LED lighting to obtain the best image.

 

Non destructive measurement to protect products.

High speed sample measuring saves time and cost in 3D measuring.

Quickly produces report to reduce arrangement time.

Comprehensive software, hardware support and service are provided.

 

LED lighting is stable and has long life time. It can reduce repair time and cost.

The inspection of depth and height reaches the best economic benefits.

Feedback detailed information to realize manufacturing problems.

PCB Inspection Series

 
Wiring Inspection Series
 
  RTR AOI
High-Resolution AOI 4.0
Circuit AOI 4.0
Circuit AOI
ArtWork AOI
LineGauge
   
 
IC Substrate, HDI & FPCB Inspection + Measuring Series
 
  3D AOI
Solid Measuring Viewer
LaserVia AOIM
   
 
AFI Series
 
  AFI
FPCB AVI
CSP AFI
   
 
Drilling & Routing Measuring Series
 
  Hole AOI/Express
EZ3D

COF Inspection Series

  COF AOI

Semiconductor Series