CSP AFI
Foreign Material nearby SM Opening |
Trace Nick |
Short under SM |
SM uneven |
CSPAFI integrating AOI+AVI algorithm and advanced Fast-Capturing-Multi-Illumination optical system can balance both detection capability and production. This most effective solution is designed for all kinds of substrate such as 3DIC, SOP, BOL, wire bond, PBGA, SD card, RF, MEMs…etc.
CSPAFI is provided with upgrade flexibility in optical system and software.
Machvision’s RD and service team can provide full supporting to solve customer’s problems of new production or developing products.
>Quickly creating new project decreases the waiting time and gets into the production promptly.
>Fast-Capturing-Multi-Illumination system connected with accurate inspection logic can balance both detection capability and production and also reach the best economic benefits.
>Comprehensive software, hardware support and service are provided. Best partner relationship for fast production variation and new product developing.
>Best optical solution combined with circuit AOI inspection logic provides excellent detection capability for open/short and nick/protrusion trace defects under solder mask.
>Innovative inspect logic adapting for solder mask shift can prevent defect skip such as foreign material between bumps and trace short nearby SM opening.
>Intellectual parameter setting shortens learning time.