Brief
:
High-Density Interconnection or HDI and
Flip-chip are revolutionizing the production
of precision electronics. Traditional blind via inspection employed only a 3D measuring machine and a coaxial light. Blind vias were inspected one by one an approach that was labor intensive, painstaking and impractical. Our new Laservia-AOIM system reduces the inspection time of HDI and Flip-chip panels from hours to mere minutes!
Feature :
The most cost-efficient solution for your laser-drilling inspection
needs
Fast scan for blind via defects ensures high laser drilling quality
Use Target & Distribute plus diagrams to optimize your laser drilling parameters
More Info :
The Laservia-AOIM system provides complete inspection capability. Because of our brilliant line-scan technology, the measuring time will depend on the board size not the amount of via. A 50cm by 50cm board can be processed within minutes.
The Laservia-AOIM system inspects for all of the following blind via defects: board shrinkage/expansion, conformal mask shifts, missing etchings, underdrilling, overdrilling, pad shifts, bias drilling, and relative size differences. Diagrams from our patented Target & Distribute plus analysis tool reveal both the distribution and nature of defects. This analysis can be used to properly adjust your laser drilling parameters for increased efficiency. With a faster inspection time and the tools for complete analysis, the Laservia-AOIM gives you the competitive edge that you need. To fit in different measuring requirement, we provide 2 models for FR4 and ABF inspection.
Brief
:
