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HDI 4W AET
Designed for HDI boards with fine line routing, micro vias, and multi layer stacks. Ideal for smartphones, tablets, wearables and other high speed, high frequency products.
Key Features:
• High Speed Measurement – Utilises the Flash™ 3rd generation measurement engine; each point is tested in an ultra short cycle, dramatically accelerating the overall test flow.
• Clamp (4–8 interchangeable claws) – Provides controllable gripping force and micron level positioning, protecting ultra thin substrates while offering the flexibility to adapt to different board sizes.
• Breakdown Detection – Independent high speed measurement channel delivers real time, predictive breakdown detect, capable of catching high voltage layer to layer shorts and micro opens.
• AOI Electrical Test Integration – Built in AOIn™ image engine provides automatic alignment and rapid calibration, cutting fixture setup time dramatically.
Typical Applications:
• Multi layer HDI boards for smartphones, tablets, wearables
• Miniature antennas, optical communication links, high frequency/high speed transmission lines
• Any high density interconnect product that requires precise four wire testing
Customer Benefits:
• Very fast test cycles; fully automated flow reduces overall test time
• Micron level positioning and stable gripping improve test reliability
• Immediate predictive alerts help catch potential failures early
• Integrated AOI electrical testing lowers labor costs and shortens fixture adjustment time
Key Features:
• High Speed Measurement – Utilises the Flash™ 3rd generation measurement engine; each point is tested in an ultra short cycle, dramatically accelerating the overall test flow.
• Clamp (4–8 interchangeable claws) – Provides controllable gripping force and micron level positioning, protecting ultra thin substrates while offering the flexibility to adapt to different board sizes.
• Breakdown Detection – Independent high speed measurement channel delivers real time, predictive breakdown detect, capable of catching high voltage layer to layer shorts and micro opens.
• AOI Electrical Test Integration – Built in AOIn™ image engine provides automatic alignment and rapid calibration, cutting fixture setup time dramatically.
Typical Applications:
• Multi layer HDI boards for smartphones, tablets, wearables
• Miniature antennas, optical communication links, high frequency/high speed transmission lines
• Any high density interconnect product that requires precise four wire testing
Customer Benefits:
• Very fast test cycles; fully automated flow reduces overall test time
• Micron level positioning and stable gripping improve test reliability
• Immediate predictive alerts help catch potential failures early
• Integrated AOI electrical testing lowers labor costs and shortens fixture adjustment time
